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1. general description the TDA9935 is optimized to reduce architecture complexity and overall system cost. thanks to its direct if conversion capabilities, it leads dynamic performance in multi-carrier support. with an internal sampling rate up to 160 msample/s, TDA9935 is an extremely competitive solution for wcdma, cdma2000 and gsm/edge transmitters, as well as high data rate radio services like wll, lmds and bwa. 2. features n dual 14-bit resolution n sfdr = 80 dbc at 2.5 mhz n input data rate up to 80 msample/s n 2 interpolation ?lter n output data rate up to 160 msample/s n single 3.3 v power supply n low noise capacitor-free integrated pll n low power dissipation n htqfp80 package n ambient temperature from - 40 c to +85 c 3. applications n broadband wireless systems n digital radio links n cellular base stations n instrumentation TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating digital-to-analog converter (dac) rev. 04 17 september 2007 product data sheet
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 2 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 4. ordering information 5. block diagram table 1. ordering information type number package name description version TDA9935hw htqfp80 plastic thermal enhanced thin quad ?at package; 80 leads; body 12 12 1 mm; exposed die pad sot841-1 (1) pins 1, 3, 61, 65, 76 and 80. (2) pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) pins 18, 26, 36, 43, 63 and 78. fig 1. block diagram 14 14 001aab119 pll TDA9935 fir fir 14 14 14 (clk 2) (clk 2) (clk 2) clock driver latch latch 14 5 clk 2, 8 i.c. 10, 51 v ccd (1) v cca (2) agnd (3) dgnd (4) dec 6 31 to 34, 37 to 42, 45 to 48 11 to 16, 19 to 24, 27, 28 dac v cca dac internal band gap clkn q13 to q0 i13 to i0 ioutn gapout 69 73 68 72 iout qout qoutn 58 57 gapd 60 ivires u/i v cca u/i 59 qvires
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 3 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin con?guration TDA9935hw v cca ivires i.c. qvires v cca gapout agnd gapd clk dgnd clkn dgnd agnd dgnd i.c. dgnd dgnd dgnd v ccd v ccd i13 dgnd i12 dgnd i11 q0 i10 q1 i9 q2 i8 q3 dgnd dgnd dec dec i7 q4 i6 q5 i5 v cca i4 agnd i3 dec i2 agnd dgnd v cca dec agnd i1 agnd i0 iout dgnd ioutn dgnd agnd q13 agnd q12 qout q11 qoutn q10 agnd dgnd agnd dec v cca q9 agnd q8 dec q7 agnd q6 v cca 001aab120 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 dgnd table 2. pin description symbol pin type [1] description v cca 1 s analog supply voltage i.c. 2 i/o internally connected; leave open v cca 3 s analog supply voltage agnd 4 g analog ground clk 5 i clock input clkn 6 i complementary clock input agnd 7 g analog ground i.c. 8 o internally connected; leave open dgnd 9 g digital ground
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 4 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac v ccd 10 s digital supply voltage i13 11 i i data input bit 13 (msb) i12 12 i i data input bit 12 i11 13 i i data input bit 11 i10 14 i i data input bit 10 i9 15 i i data input bit 9 i8 16 i i data input bit 8 dgnd 17 g digital ground dec 18 o decoupling node i7 19 i i data input bit 7 i6 20 i i data input bit 6 i5 21 i i data input bit 5 i4 22 i i data input bit 4 i3 23 i i data input bit 3 i2 24 i i data input bit 2 dgnd 25 g digital ground dec 26 o decoupling node i1 27 i i data input bit 1 i0 28 i i data input bit 0 (lsb) dgnd 29 g digital ground dgnd 30 g digital ground q13 31 i q data input bit 13 (msb) q12 32 i q data input bit 12 q11 33 i q data input bit 11 q10 34 i q data input bit 10 dgnd 35 g digital ground dec 36 o decoupling node q9 37 i q data input bit 9 q8 38 i q data input bit 8 q7 39 i q data input bit 7 q6 40 i q data input bit 6 q5 41 i q data input bit 5 q4 42 i q data input bit 4 dec 43 o decoupling node dgnd 44 g digital ground q3 45 i q data input bit 3 q2 46 i q data input bit 2 q1 47 i q data input bit 1 q0 48 i q data input bit 0 dgnd 49 g digital ground dgnd 50 g digital ground table 2. pin description continued symbol pin type [1] description
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 5 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac [1] type description: s: supply; g: ground; i: input; o: output. v ccd 51 s digital supply voltage dgnd 52 g digital ground dgnd 53 g digital ground dgnd 54 g digital ground dgnd 55 g digital ground dgnd 56 g digital ground gapd 57 i internal band gap power disable input gapout 58 i/o band gap output voltage qvires 59 i q dac biasing resistor ivires 60 i i dac biasing resistor v cca 61 s analog supply voltage agnd 62 g analog ground dec 63 o decoupling node agnd 64 g analog ground v cca 65 s analog supply voltage agnd 66 g analog ground agnd 67 g analog ground qoutn 68 o complementary q dac output current qout 69 o q dac output current agnd 70 g analog ground agnd 71 g analog ground ioutn 72 o complementary i dac output current iout 73 o i dac output current agnd 74 g analog ground agnd 75 g analog ground v cca 76 s analog supply voltage agnd 77 g analog ground dec 78 o decoupling node agnd 79 g analog ground v cca 80 s analog supply voltage table 2. pin description continued symbol pin type [1] description
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 6 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 7. functional description the dac is a segmented architecture composed of a 7-bit thermometer sub-dac, and the remaining 7-bit in a binary weighted sub-dac. the device produces two complementary current outputs on both channels, respectively pins iout/ioutn and qout/qoutn which need to be connected via a load resistor to the ground. figure 3 shows the equivalent analog output circuit of one dac, which consists of a parallel combination of pmos current sources and associated switches for each segment. the cascode source con?guration enables to increase the output impedance of the source and set to improve the dynamic performance of the dac by introducing less distortion. figure 4 shows the internal reference con?guration. in this case the bias current is given by the output of the internal regulator connected to the inverting input of the internal operational ampli?ers, while external resistors r i and r q are connected respectively to pins ivires and qvires. thus the output current of the two dacs is typically ?xed to 20 ma with an appropriate choice of these resistors. this con?guration is optimal for temperature drift compensation because the band gap can be matched with the voltage on the feedback resistors. the relation between full-scale output current i o(fs) and the r i (r q ) is: w the output current can also be adjusted by imposing an external reference voltage to the inverting input pin gapout and disabling the internal band gap with pin gapd set to high. at a voltage lower than 1.2 v the current can be set at values lower than 20 ma. the input references at pins ivires and qvires may also be driven by separate reference voltages to adjust independently the two dac currents. r i 2048 v gapout 82 i ofs () ------------------------------------------ = fig 3. equivalent analog output circuit fig 4. internal reference con?guration 001aab124 agnd r l r l agnd iout/qout ioutn/qoutn TDA9935 001aab125 qvires ivires gapout agnd gapd internal band gap i dac current sources array TDA9935 q dac current sources array r i r q
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 7 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 8. limiting values [1] all supplies are connected together. 9. thermal characteristics table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ccd digital supply voltage [1] - 0.3 +3.9 v v cca analog supply voltage [1] - 0.3 +3.9 v d v cca-ccd supply voltage difference between the analog and digital supply voltages - 150 +150 mv v i voltage at input pins pins qn and in referenced to dgnd - 0.3 v ccd + 0.3 v pins ivires, qvires and gapd referenced to agnd - 0.3 v cca + 0.3 v pins clk and clkn referenced to agnd - 0.3 v cca + 0.3 v v o voltage at output pins pins iout, ioutn, qout and qoutn referenced to agnd - 0.3 v cca + 0.3 v t stg storage temperature - 55 +150 c t amb ambient temperature - 40 +85 c t j junction temperature - 125 c table 4. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air 27.1 k/w r th(c-a) thermal resistance from case to ambient in free air 11.8 k/w
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 8 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 10. characteristics table 5. characteristics v ccd =v cca = 3.0 v to 3.6 v; agnd and dgnd connected together; t amb = - 40 c to +85 c; typical values measured at v ccd =v cca = 3.3 v, i o(fs) = 20 ma and t amb =25 c; dynamic parameters measured using output schematic given in figure 10 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit supplies v ccd digital supply voltage 3.0 3.3 3.6 v v cca analog supply voltage 3.0 3.3 3.6 v i ccd digital supply current - 55 65 ma i cca analog supply current - 73 85 ma p tot total power dissipation f clk = 80 msample/s; f iout =f qout = 5 mhz - 422 540 mw clock inputs (clk and clkn) v i(cm) common mode input voltage - 1.65 - v d v clk differential input voltage swing - 1.0 - v analog outputs (iout, ioutn, qout and qoutn) i o(fs) full-scale output current differential outputs 4 - 20 ma r o output resistance [1] - 150 - k w c o output capacitance [1] -3-pf digital inputs (i0 to i13, q0 to q13 and gapd) v il low-level input voltage dgnd - 0.3v ccd v v ih high-level input voltage 0.7v ccd -v ccd v i il low-level input current v il = 0.3v ccd -5- m a i ih high-level input current v ih = 0.7v ccd -5- m a reference voltage output (gapout) v gapout output voltage - 1.31 - v i gapout output current external voltage - 1 - m a d v gapout output voltage drift - 133 - ppm/ c clock timing inputs (clk and clkn) f clk(max) maximum clock rate 80 - - msample/s t w(clkh) clock high pulse width 5 - - ns t w(clkl) clock low pulse width 5 - - ns input timing (i0 to i13 and q0 to q13); see figure 5 t h(i) input hold time 1.1 - 3.4 ns t su(i) input setup time - 1.5 - +0.7 ns
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 9 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac digital ?lter speci?cation (fir); see figure 6 , figure 7 and t ab le 7 n order - 42 - f i(d) data input rate 80 - - msample/s r pbw ripple in pass bandwidth f data /f clk ; 0.005 db attenuation - 0.405 - pbw pass bandwidth f data /f clk ; 3 db attenuation - 0.479 - sbr stop band rejection f data /f clk = 0.6 to 1 - 69 - db t d(g) group delay time - 11t clk -ns analog signal processing inl integral non-linearity - 2.9 - lsb dnl differential non-linearity - 1.5 - lsb i n(o) output noise current - 120 - pa/ ? hz e offset(o) output offset error relative to full scale - - 0.3 - % e g gain error relative to full scale - 5.4 - +5.4 % m g gain matching between i and q, relative to full scale - 0.2 - % sfdr spurious-free dynamic range f clk = 80 msample/s; bw = nyquist f out = 2.5 mhz at 0 dbfs - 80 - dbc f out = 5 mhz at 0 dbfs - 72 - dbc f out = 13 mhz at 0 dbfs - 64 - dbc h2 second harmonic f out = 5 mhz - 73 - dbc f out = 13 mhz - 65 - dbc h3 third harmonic f out = 5 mhz - 88 - dbc f out = 13 mhz - 86 - dbc imd2 second order two-tone intermodulation rejection f clk = 80 msample/s; f out1 = 10 mhz; f out2 = 12 mhz; bw = nyquist - 65 - dbc imd3 third order two-tone intermodulation rejection f clk = 80 msample/s; f out1 = 10 mhz; f out2 = 12 mhz - 84 - dbc thd total harmonic distortion f clk = 80 msample/s; bw = nyquist f out = 2.5 mhz - 75 - dbc f out = 5 mhz (t amb =25 c) 68 71 - dbc nsd noise spectral density f clk = 80 msample/s f out = 2.5 mhz - - 155 - dbm/hz f out = 5 mhz - - 155 - dbm/hz f out = 19 mhz - - 153 - dbm/hz table 5. characteristics continued v ccd =v cca = 3.0 v to 3.6 v; agnd and dgnd connected together; t amb = - 40 c to +85 c; typical values measured at v ccd =v cca = 3.3 v, i o(fs) = 20 ma and t amb =25 c; dynamic parameters measured using output schematic given in figure 10 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 10 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac [1] guaranteed by design. s/n signal-to-noise ratio f clk = 80 msample/s; bw = nyquist f out = 2.5 mhz - 80 - dbc f out = 5 mhz 70 80 - dbc f out = 19 mhz - 78 - dbc acpr adjacent channel power ratio baseband; 5 mhz channel spacing; bw = 3.4 mhz f out = 2.5 mhz - 69 - dbc f out = 20 mhz - 71 - dbc table 5. characteristics continued v ccd =v cca = 3.0 v to 3.6 v; agnd and dgnd connected together; t amb = - 40 c to +85 c; typical values measured at v ccd =v cca = 3.3 v, i o(fs) = 20 ma and t amb =25 c; dynamic parameters measured using output schematic given in figure 10 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit table 6. band gap band gap disable (gapd) band gap input/output (gapout) internal band gap low output (v gapout = 1.2 v) enable high input disable fig 5. input timing diagram 001aab121 q0 to q13 t su(i) t h(i) clkn clk iout/ioutn, qout/qoutn 50 % i0 to i13,
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 11 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac fig 6. fir ?lter frequency response fig 7. fir ?lter impulse response normalized frequency (f out /f clk ) 0 1.0 0.8 0.4 0.6 0.2 001aab122 - 100 - 60 - 140 - 20 20 output (db) - 180 t (sample) 040 30 10 20 001aab123 0.2 0 0.4 0.6 normalized output - 0.2 table 7. interpolation fir ?lter coef?cient coef?cient coef?cient value h(1) h(43) 10 h(2) h(42) 0 h(3) h(41) - 31 h(4) h(40) 0 h(5) h(39) 69 h(6) h(38) 0 h(7) h(37) - 138 h(8) h(36) 0 h(9) h(35) 248 h(10) h(34) 0 h(11) h(33) - 419 h(12) h(32) 0 h(13) h(31) 678 h(14) h(30) 0 h(15) h(29) - 1083 h(16) h(28) 0 h(17) h(27) 1776 h(18) h(26) 0 h(19) h(25) - 3282 h(20) h(24) 0 h(21) h(23) 10364 h(22) - 16384
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 12 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 11. application information fig 8. single-ended clock schematic fig 9. differential clock schematic 001aab126 1 k w 100 nf v th 1 k w agnd clkn v cca clk TDA9935 r s 001aab127 1 k w 100 nf 1 k w clkn v cca agnd agnd agnd clk TDA9935 1 k w 1 k w 100 nf 100 nf
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 13 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac all resistors are 1 % precision resistors. c = 100 nf. fig 10. application diagram c TDA9935 v cca ivires i.c. qvires v cca gapout agnd gapd clk dgnd clkn dgnd agnd dgnd agnd 3.3 v agnd 3.3 v agnd dgnd 3.3 v dgnd dgnd dgnd dgnd dgnd 3.3 v dgnd dgnd i.c. dgnd dgnd dgnd v ccd v ccd i13 dgnd i12 dgnd i11 q0 i10 q1 i9 q2 i8 q3 dgnd dgnd dec dec i7 q4 i6 q5 i5 v cca i4 agnd i3 dec i2 agnd dgnd v cca dec agnd i1 agnd i0 iout dgnd ioutn dgnd agnd q13 agnd q12 qout q11 qoutn q10 agnd dgnd dec agnd v cca q9 agnd q8 dec q7 agnd q6 v cca 001aab495 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 c c c c c 1.5 k w 1.5 k w c c c agnd agnd agnd agnd agnd agnd agnd 3.3 v 3.3 v 3.3 v 3.3 v c cc c cc c 50 w 50 w (rload) 50 w agnd agnd c 50 w 50 w (rload) 50 w agnd agnd agnd agnd 1:1 1:1
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 14 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 12. package outline fig 11. package outline sot841-1 (htqfp80) references outline version european projection issue date iec jedec jeita sot841-1 ms-026 sot841-1 04-01-15 note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included unit a max mm 1.2 0.15 0.05 1.05 0.95 0.27 0.17 0.20 0.09 12.1 11.9 12.1 11.9 14.15 13.85 14.15 13.85 0.75 0.45 1.45 1.05 1.45 1.05 a 1 dimensions (mm are the original dimensions) htqfp80: plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad 80 21 61 40 120 60 41 b p b p d h d eh e b a d h e h y z d z e e e w m w m pin 1 index vb m va m c exposed die pad x q a l p detail x l (a 3 ) a 2 a 1 0 5 10 mm scale a 2 a 3 0.25 b p c d (1) e (1) e 0.5 h d 6.05 5.95 d h 6.05 5.95 e h h e l 1 l p v 0.2 w 0.08 y 0.1 z d (1) z e (1) q 7 0
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 15 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 13. abbreviations 14. glossary 14.1 static parameters dnl differential non-linearity. the difference between the ideal and the measured output value between successive dac codes. inl integral non-linearity. the deviation of the transfer function from a best-?t straight line (linear regression computation). 14.2 dynamic parameters imd2 two-tone intermodulation distortion rejection; second order. from a dual-tone digital input sine wave (these two frequencies are close together), the intermodulation distortion product imd2 is the ratio of the rms value of either tone and the rms value of the worst 2nd-order intermodulation product. imd3 two-tone intermodulation distortion rejection; third order. from a dual-tone digital input sine wave (these two frequencies are close together), the intermodulation distortion product imd3 is the ratio of the rms value of either tone and the rms value of the worst 3rd-order intermodulation product. sfdr spurious-free dynamic range. the ratio between the rms value of the reconstructed output sine wave and the rms value of the largest spurious observed (harmonic and non-harmonic, excluding dc component) in the frequency domain. s/n signal-to-noise ratio. the ratio of the rms value of the reconstructed output sine wave to the rms value of the noise excluding the harmonics and the dc component. table 8. abbreviations acronym description bw bandwidth bwa broadband wireless access cdma code division multiple access edge enhanced data rates for gsm evolution fir finite impulse response if intermediate frequency lmds local multipoint distribution service lsb least signi?cant bit msb most signi?cant bit pll phase-locked loop pmos positive-metal oxide semiconductor sfdr spurious-free dynamic range wcdma wideband code division multiple access wll wireless local loop
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 16 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac thd total harmonic distortion. the ratio of the rms value of the harmonics of the output frequency to the rms value of the output sine wave. usually, the calculation of thd is done on the ?rst 5 harmonics. 15. revision history table 9. revision history document id release date data sheet status change notice supersedes TDA9935_4 20070917 product data sheet - TDA9935_3 modi?cations: ? amended the (alternative) descriptive title TDA9935_3 20070611 product data sheet - TDA9935_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? extended abbreviations list in section 13. TDA9935_2 20060809 preliminary data sheet - TDA9935_1 TDA9935_1 (9397 750 13346) 20041214 objective data sheet - -
TDA9935_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 17 september 2007 17 of 18 nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors TDA9935 dual 14-bit, up to 160 msample/s, 2 interpolating dac ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 17 september 2007 document identifier: TDA9935_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 6 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 thermal characteristics. . . . . . . . . . . . . . . . . . . 7 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 application information. . . . . . . . . . . . . . . . . . 12 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14.1 static parameters . . . . . . . . . . . . . . . . . . . . . . 15 14.2 dynamic parameters. . . . . . . . . . . . . . . . . . . . 15 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 contact information. . . . . . . . . . . . . . . . . . . . . 17 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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